Pioneering the Future of Micro-Assembly and Micro-Packaging
OUR STORY
Since 2016
At RuiSheng An Technology, we’re not just keeping pace with the rapidly evolving micro-assembly and micro-packaging market – we’re defining it. Our innovative use of new materials and processes, including ceramics, aluminum composites, copper composites, CMC, CPC, and gold-tin solder windows, sets us apart in the industry.
Our forward-thinking SOP system integration packaging concept emphasizes circuit design and integrated manufacturing. Compatible with advanced packaging technologies like SOC, MCM, and SIP, our approach meets the specific needs for high-density, high-power, miniaturization, and low-cost chip packaging modules.
Since 2016
Years of technical accumulation and scientific breakthroughs have equipped us with core design and process technologies, including thermal adaptation mold design, structural reliability finite element analysis, microwave radio frequency simulation, brazing sealing, surface coating, precision machining, and HTCC high-temperature ceramic process.
Core Values
At the heart of RuiSheng An Technology lies our commitment to pioneering new technologies, fostering innovation, and delivering excellence. We believe in the power of collaboration, the pursuit of knowledge, and the importance of technological advancement.
Our Vision
RuiSheng An Technology envisions a future where advanced micro-assembly and micro-packaging solutions drive the next wave of technological innovation, powering a world that’s smarter, faster, and more efficient.
